Epoxy moulding resin
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Cotronics® high performance casting, embedding and encapsulating compounds can be used for applications up to 315°C.
Cotronics® moulding resin
861 Low viscosity impregnant: 260°C max. It provides excellent penetration even into tightly wound coils and it has excellent electrical, moisture and chemical resistance.
862 High temperature, low viscosity: 315°C. It needs to be cured at 120°C. It provides excellent penetration and has excellent electrical, moisture and chemcial resistance.
863 High temperature potting: 315°C. It needs to be cured at 120°C. It offers excellent dielectric properties, heat stability, moisture and solvent resistance.
864 Flexible, cures at room temperature: 230°C max. It provides the flexibilty required for severe thermal shock applications.
865 High thermal conductivity: 260°C max. For applications requiring high heat flows and rapid thermal dissipation.
866 Thermally insulating: 260°C max. Thermally and electrically insulating compound. It forms a low density, non porous foam for high temperature applications that require these unusual combinations of properties.
868 High temperature flexible: 260°C max. A high temperature flexible epoxy ideal for thermal shock applications, stress free potting and bonding. It offers high electrical resistance, even at high temperatures.