Share this page by mail Alumina substrate vs aluminium nitride (AlN): what are the differences in terms of thermal conductivity?
Alumina (density of 3.95 g/cm³, Al₂O₃ 99.7%) has a moderate thermal conductivity of 25 to 30 W/(m·K) and a dielectric strength of 10 to 12 kV/mm. However, aluminium nitride (AlN) combines a density of approximately 3.2 g/cm³, a very high thermal conductivity (170 to 200 W/(m·K)) and a dielectric strength of 10 kV/mm while also remaining stable up to 1,000°C. Therefore AlN ensures better thermal transfers for critical electronic circuits, while alumina is mainly used for more cost-effective applications, or applications requiring only standard electrical insulation. If thermal dissipation is a determining factor, Final Advanced Materials recommends choosing AlN.
Aluminium nitride substrates (AlN) are the ideal solution for optimum thermal dissipation. They have a high thermal conductivity of 170 to 200 W/(m·K), a density of approximately 3.2 g/cm³ and a dimensional stability up to 1,000°C. Alternatively, you can choose alumina substrates (Al₂O₃), which have a lower conductivity (of 25 to 30 W/(m·K)) but which are more cost-effective. AlN effectively dissipates heat from high-power-density circuits, limiting hot spots and increasing reliability. Final Advanced Materials recommends AlN for high-performance applications such as high-power LEDs and thermally sensitive microelectronic components.
Ceramic substrates are available in standard thicknesses from 0.15 mm to 2.0 mm, with typical dimensions ranging from 50.8×50.8 mm to 168×168 mm depending on the material. Custom dimensions can be provided to meet specific requirements. Dimensional tolerance is generally +0.2/-0.05 mm. Final Advanced Materials can also provide substrates meeting industrial requirements, with machining, drilling or etching options for direct integration into electronic devices.
Yes, alumina Al₂O₃ or alumina nitride AlN ceramic substrates can be supplied with custom laser cutting, making it possible to produce complex shapes. Laser cutting ensures a neat cut, with tolerances of ±0.05 mm and low mechanical stress. This technology is particularly suitable for thin substrates (0.25–1.0 mm) and the production of small series requiring speed and precision.
Final Advanced Materials produces laser-cut substrates based on the plans provided by the client, while preserving dimensional stability and the material's electrical and thermal properties.