High Temperature Adhesives
Final Advanced Materials offers a rangeof high-temperature adhesives suitable for applications from 200°C to over 2000°C.
Cotronics® ceramic cement
Ceramic bonding cement
Our wide range of Cotronics® high-temperature ceramic cement adhesives will allow you to select the most suitable product for your needs, up to more than 2000°C. Ceramic adhesives have been created to bond ceramic with ceramic, metal, glass or plastic, essential for research, electronics, metallurgy, industrial and nuclear applications and more.
Ceramic coating cement
Encapsulations are intended to protect and insulate circuits and components. The Cotronics® Durapot range is designed to meet a variety of thermal, physical and electrical requirements. They harden at room temperature, and this can be accelerated by light heating. Excellent resistance to chemicals and solvents.
Moulding ceramic cement
Six grades of Cotronics® Rescor mouldable ceramics are available. Each of these refractory cements is economical and efficient in the temperature range for which it is recommended. They are delivered ready to use, simply add demineralised and deionised water to use them, or the appropriate activator. They are moulded to make shaped pieces. Surface condition and accuracy depend on the quality and finish of the tooling.
Cotronics® epoxy resin
High-temperature epoxy resin
Our wide range of Cotronics® high-temperature ceramic cement adhesives will allow you to select the most suitable product for your needs, up to 350°C and higher, to bond ceramic with ceramic, metal, glass or plastic, essential for research, electronics, metallurgy, industrial and nuclear applications and more.
Electro-conductive epoxy resin
By combining Cotronics® specially loaded resins and hardeners, we have achieved these electrical conductivity required by some applications. The conductive layers enabled by these products can replace electronic solders, fix transistors in place, repair circuit boards, draw conductive paths and more. They bond to glass, ceramic, metals and most plastics. Their polymerisation can be accelerated to 120°C and above.
Thermal-conductive epoxy resin
By combining specially loaded Cotronics® resins and hardeners we have achieved the thermal conductivity required by some high-temperature applications. The temperature resistance can reach 260°C or even 350°C (resin 133). The test assemblies are still in use. These bondings adhere to glass, ceramics, metals and plastics. They have excellent resistance to common chemicals and solvents.
Moulding epoxy resin
Our wide range of Cotronics® high-performance moulding epoxy resins will enable you to select the most suitable product for your moulding application up to 315°C.
These adhesives are suitable for metal-glass bonding (aluminium, stainless steel, steel etc.), ceramic and selected plastics. These films are available as a dry layer of bismaleimide adhesive on a polyester carrier film. Treating with film adhesives is in many cases simpler than adhesive pastes since the adhesive can be cut to the desired shape and then applied to the required surface.
Unlike to traditional methods such as mechanical fastening, welding and brazing, which are mainly suitable for similar materials and often involve perforations and high localised mechanical stresses, we use cutting-edge adhesive bondings for our multi-material assembly.
This method offers several benefits: no deterioration of substrates, uniform distribution of stresses and aesthetic appearance.