Share this page by mail Surface preparation – Bostik Born2Bond™
Why is surface preparation important?
Surface preparation is the key to a successful adhesive bonding operation. Removing contaminants such as grease, dust, and particles is necessary for a high quality and long-lasting adhesive bond.
Sometimes, substrate preparation is the only way to guarantee that the parts are properly bonded together. In these cases, it is important to consider the substrate's surface energy and pH to ensure a high enough wettability and optimal adhesion.
Cleaning a surface and applying a primer might seem unnecessary, but it is the best way to ensure a reliable and high-quality adhesive bond. Ready to take your adhesive bonding applications to the next level? Check out Bostik's range of solutions for degreasing, cleaning, substrate preparation, and curing acceleration, all designed to improve their adhesive's performance. These solutions are also recommended for adhesive bonding applications using Cotronics® products.
Our range of products for surface preparation
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Born2Bond™ Seez-Release
The Born2Bond™ Seez-Release’s unique formula removes all traces of rust and corrosion on screws, screw threads, pipe flanges, and casings. And its Cobra head allows for easy application of product in all positions
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Born2Bond™ Adhesive & Gasket Remover
The Born2Bond™ Adhesive and Gasket Remover 500 ml aerosol and its Cobra-head easily removes all traces of glue and gaskets from surfaces ahead of bonding. Its efficient chemical formula can be completed by a mechanical action if needed
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Born2Bond™ Pre-Bonding Cleaner
The Born2Bond™ Pre-Bonding Cleaner 500 ml aerosol and its Cobra-head quickly removes all traces of grease, oil, lubrication, dust, humidity, and other contaminants from surfaces ahead of bonding, without leaving any residue
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Born2Bond™ Primer
The Born2Bond™ Primer increases the surface energy of low surface energy substrates (such as polyethylene, polypropylene, PTFE and thermoplastic rubber materials) for successful bonding applications.
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Born2Bond™ Anaerobic Activator
The Born2bond™ Anaerobic Activator 200 ml spray is designed to accelerate curing on passive metal surfaces (screw threads, threading, flat side of housings, etc.). It is also used when the gap between two surfaces is wider than 5 mm or when the temperature when bonding is lower than 10 °C.
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Born2Bond™ Booster
The Born2Bond™ Booster accelerates cyanoacrylate curing on wood and plastic surfaces. Thanks to its long open time and short drying time, this product is the perfect solution to quickly bond pieces that will immediately be subjected to mechanical stress.
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Born2Bond™ 6-in-1 Lubricant
The Born2Bond™ 6-in-1 Lubricant is a multi-purpose lubricant designed to keep moving parts operating correctly. It repels moisture, prevents corrosion, and uses a capillary effect to penetrate rust, making it perfect for general maintenance in workshops.
SEEZ-RELEASE - BOSTIK BORN2BOND™
ADHESIVE & GASKET REMOVER - BOSTIK BORN2BOND™
PRIMER - BOSTIK BORN2BOND™
ANAEROBIC ACTIVATOR - BOSTIK BORN2BOND™
6-IN-1 LUBRICANT - BOSTIK BORN2BOND™
Booster - Cyanoacrylate adhesive Bostik Born2Bond™
Cleaner - Bostik Born2Bond™
FAQs that can help you in this category
The choice depends mainly on the temperature and the mechanical stresses. Final Advanced Materials' high-temperature epoxy resins are generally limited to between 150 and 350°C, with satisfactory mechanical resistance (typical sheer-stress 10–30 MPa) and a degree of elasticity. However, the ceramic cements produced by Final Advanced Materials can be used up to 2,200°C, depending on the grade (alumina, zirconia, silicate, silica). They have excellent temperature resistance, but remain fragile (brittle behaviour, no elasticity). In the case of assemblies subject to differential expansion or vibration, epoxy is by far the preferred solution, if permitted by the maximum temperature of the application. However, in the case of extreme environments (kiln, vacuum, reducing atmosphere) which exceed 350°C, ceramic cement must be chosen.
The ceramic cements distributed by Final Advanced Materials have maximum working temperatures ranging between 650°C and 2,200°C. For example, alumina-based formulations often reach 1,650–1,760°C in an oxidising atmosphere. However, silicate systems are limited to around 1,000–1,200°C. The real maximum working temperature depends greatly on the environment (air, vacuum, inert gas), the time of exposure to this temperature and the thermal cycle (gradient, thermal shock). Specifically: the metal-loaded ceramic adhesives produced by Final Advanced Materials resist only up to the maximum temperature of the filler (650°C, for example, in the case of aluminium powder).
Ceramic/metal assemblies require often very different coefficients of thermal expansion (CTE) to be controlled. Final Advanced Materials recommends alumina-, silica- or zirconia-based ceramic cements for temperatures >350°C, which can bond to all types of ceramics and, generally, metals. For intermediate applications (≤350°C), an epoxy resin loaded with alumina powder enables thermal stresses to be absorbed and will be very compatible with different expansion coefficients. The thickness of the bond line must be between 100 and 300 µm to limit stress. Surface pre-treatment (sanding, degreasing, etc.) greatly improves adherence and is absolutely necessary if the CETs are very different.
The Cotronics adhesives distributed by Final Advanced Materials have variable cycles.
In the case of a cement, initial drying at ambient temperature takes between 2 to 24 h, depending on the viscosity and thickness. A thermal aftertreatment can be performed to allow them to attain their optimum properties after firing. Excessively rapid drying can lead to cracking or porosity in the cement.
Final Advanced Materials' epoxy adhesives which resist up to 260°C must be cured at ambient temperature. Epoxy adhesives which resist up to over 300°C require heat curing.