High temperature adhesive
Final Advanced Materials can provide you high temperature adhesives for application from 200°C up to more than 2000°C : ceramic adhesive, epoxy adhesive, bismaleimide film.
High temperature adhesive presentation
In order to choose the right adhesive for your application in our range of products, first of all you need to have :
- Max and continuous temperature
- Mechanical stress
- Electrical characteristics
- Product to bond
Epoxy adhesive up to 350°C
We offer Duralco® Cotronics high temperature epoxy-based adhesives, for temperatures up to 350°C.
Special versions of these adhesives with special characteristics are available: non-magnetic, sterilizable, adaptable hardness ...
Ceramic adhesive over 2000°C
We offer Resbond® Cotronics high temperature ceramic adhesives, for temperatures up to 2200°C.
These adhesives have excellent adhesion to ceramics, metals, glass and plastics. They offer excellent high temperature stability, dielectric strength, mechanical properties and thermal shock resistance.
Bismaleimid film up to 240°C
307 is a solvent-free, hot-curing adhesive film with high temperature and media resistance. At room temperature it is not tacky and can be easily cut to the shape of the bond area. Tackiness is developed at ca. 120°C, just before curing.
Don't forget to prepare your surfaces
The best way to ensure a long-lasting adhesive bond is to properly clean the parts before bonding them together. Our partner Bostik has developed a range of solutions under the Born2Bond™ brand specifically designed to cover all the different steps of the surface preparation process. These solutions are also recommended for adhesive bonding applications using Cotronics® products:
- Born2Bond™ Seez-Release
- Born2Bond™ Adhesive & Gasket Remover
- Born2Bond™ Pre-Bonding Cleaner
- Born2Bond™ Primer
- Born2Bond™ Anaerobic Activator
- Born2Bond™ Booster
- Born2Bond™ 6-in-1 Lubricant
Adhesive selector kit
Bismaleimide adhesive film
Electrically conductive Epoxy resin
High temperature Ceramic Adhesive
High Temperature Epoxy Resin
Thermally conductive epoxy
FAQs that can help you in this category
The choice depends mainly on the temperature and the mechanical stresses. Final Advanced Materials' high-temperature epoxy resins are generally limited to between 150 and 350°C, with satisfactory mechanical resistance (typical sheer-stress 10–30 MPa) and a degree of elasticity. However, the ceramic cements produced by Final Advanced Materials can be used up to 2,200°C, depending on the grade (alumina, zirconia, silicate, silica). They have excellent temperature resistance, but remain fragile (brittle behaviour, no elasticity). In the case of assemblies subject to differential expansion or vibration, epoxy is by far the preferred solution, if permitted by the maximum temperature of the application. However, in the case of extreme environments (kiln, vacuum, reducing atmosphere) which exceed 350°C, ceramic cement must be chosen.
The ceramic cements distributed by Final Advanced Materials have maximum working temperatures ranging between 650°C and 2,200°C. For example, alumina-based formulations often reach 1,650–1,760°C in an oxidising atmosphere. However, silicate systems are limited to around 1,000–1,200°C. The real maximum working temperature depends greatly on the environment (air, vacuum, inert gas), the time of exposure to this temperature and the thermal cycle (gradient, thermal shock). Specifically: the metal-loaded ceramic adhesives produced by Final Advanced Materials resist only up to the maximum temperature of the filler (650°C, for example, in the case of aluminium powder).
Ceramic/metal assemblies require often very different coefficients of thermal expansion (CTE) to be controlled. Final Advanced Materials recommends alumina-, silica- or zirconia-based ceramic cements for temperatures >350°C, which can bond to all types of ceramics and, generally, metals. For intermediate applications (≤350°C), an epoxy resin loaded with alumina powder enables thermal stresses to be absorbed and will be very compatible with different expansion coefficients. The thickness of the bond line must be between 100 and 300 µm to limit stress. Surface pre-treatment (sanding, degreasing, etc.) greatly improves adherence and is absolutely necessary if the CETs are very different.
The Cotronics adhesives distributed by Final Advanced Materials have variable cycles.
In the case of a cement, initial drying at ambient temperature takes between 2 to 24 h, depending on the viscosity and thickness. A thermal aftertreatment can be performed to allow them to attain their optimum properties after firing. Excessively rapid drying can lead to cracking or porosity in the cement.
Final Advanced Materials' epoxy adhesives which resist up to 260°C must be cured at ambient temperature. Epoxy adhesives which resist up to over 300°C require heat curing.