High temperature adhesive

High temperature adhesive : Ceramic and epoxy

Final Advanced Materials can provide you high temperature adhesives for application from 200°C up to more than 2000°C : ceramic adhesive, epoxy adhesive, bismaleimide film.

High temperature adhesive presentation

In order to choose the right adhesive for your application in our range of products, first of all you need to have :

  • Max and continuous temperature
  • Mechanical stress
  • Electrical characteristics
  • Product to bond

Epoxy adhesive up to 350°C

We offer Duralco® Cotronics® high temperature epoxy-based adhesives, for temperatures up to 350°C.

Special versions of these adhesives with special characteristics are available: non-magnetic, sterilizable, adaptable hardness ...

Ceramic adhesive over 2000°C

We offer Resbond® Cotronics® high temperature ceramic adhesives, for temperatures up to 2200°C.

These adhesives have excellent adhesion to ceramics, metals, glass and plastics. They offer excellent high temperature stability, dielectric strength, mechanical properties and thermal shock resistance.

Bismaleimid film up to 240°C

307 is a solvent-free, hot-curing adhesive film with high temperature and media resistance. At room temperature it is not tacky and can be easily cut to the shape of the bond area. Tackiness is developed at ca. 120°C, just before curing.

Adhesive selector kit

Seven high temperature adhesives in convenient 4 oz. bottles. Ideal for simplifying products evaluation and selection. Cotronics ® Resbond ® Ceramic Adhesives are based on high purity,...
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Bismaleimide film

Bismaleimide film presentation One-component bismaleimide adhesive film   • Temperature resistant to 240 °C • Very high bond strength at high temperatures • Very resistant to various...
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Electrically conductive epoxy

Cotronics ® Duralco ® conductive adhesives and potting compounds provide the conductivity required for many high temperature electronic and industrial applications. These ultra-temperature...
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High temperature Ceramic Adhesive

Resbond ® Ceramic Adhesives are based on high purity, ceramic binders and selected reinforcing fillers. They were designed to satisfy the most difficult, high temp. application requirements....
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High Temperature Epoxy Resin

Cotronics ® unique cross linked, organic-inorganic, polymer systems have excellent adhesion, high temperature stability, dielectric properties and superior chemical, corrosion and moisture...
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Thermally conductive epoxy

Cotronics ® Duralco ® Thermally Conductive Adhesives and potting compounds provide the heat dissipation required for many High Temperature Electronic and Industrial applications. These...
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