Ceramic Board 1200°C
Rescor® 360 Ceramic board
Rescor® 360 Ceramic Board by Cotronics® is made from high purity, refractory fibers. They are thoroughly interlaced in the production process and bonded with an inorganic binder. Now, strong, rigid, free standing shapes and parts are easily constructed. Just cut, saw or drill. Parts can be bonded together (if needed) with Resbond® 901 adhesive.
360 Ceramic Board offers excellent thermal shock resistance. It can be heated to 1100ºC and cooled in minutes, without cracking.
Resistant to oxidizing and reducing atmospheres, most molten metals, steam, most chemicals and solvents (not recommended).
Trace organic binders used in processing can be removed by a simple heat treatment, in air, at 400°C if required.
Use Rescor® 360 for general purpose, 360HS for construction, 360EHS for gaskets and higher strength applications.
Applications
- Realization of rigid high temperature joints
- Brackets
- Hot element separators
- Heat shield
- Chemical reactor isolation
- Laboratory equipment
- Handling of molten metals
Technical data
Properties |
Units |
||||
Reference |
360 |
360HS |
360EHS |
||
Version |
Standard |
Hard |
Very hard |
||
Melting temperature |
°C |
1760 |
1760 |
1760 |
|
Application temperature |
°C |
1250 |
1250 |
1250 |
|
Density |
g/cm3 |
0,25 |
0,53 |
0,96 |
|
Specific heat |
J/kg.K |
1050 |
1050 |
1050 |
|
Breaking |
Kg/cm² |
4 |
40 |
80 |
|
Constant μ0 at 100 MHz |
1,61 |
1,61 |
1,61 |
||
Ignition loss |
0,017 |
0,017 |
0,017 |
||
Breakdown |
V/mm |
100 |
100 |
100 |
|
Thermal conduction |
500°C |
W/m.K |
0,06 |
0,08 |
0,11 |
540°C |
W/m.K |
0,10 |
0,11 |
0,14 |
|
815°C |
W/m.K |
0,14 |
0,15 |
0,145 |
|
1100°C |
W/m.K |
0,22 |
0,25 |
0,27 |