Share this page by mail Substrate: Zirconia
Zirconia Ceramics Substrates
Final Advanced Materials supplies a wide variety of substrates: alumina, zirconia, and aluminium nitride. All our substrates are produced by laser cutting. It is possible to order plates in standard dimensions, or for parts to be cut to a customized design, whether for a prototype or for series production.
Final Advanced Materials has machining facilities which guarantee ISO 9001-certified quality. Our tooling and our expertise permit the production of the most complex components from your plans.
ZYTC substrates are thin, rigid, tape cast structures composed of zirconia stabilized with yttria at targeted stabilization concentrations. ZYTC is our thinnest zirconia material and is ideally suited as a setter for sintering microelectronics, solid oxide fuel cells and thermal management applications under conditions of high temperatures and in varied atmospheres. ZYTC has been high fired and is tightly bonded resulting in a dust free, smooth gas tight surface. ZYTC is dimensionally stable to 1,500 °C. It has exceptional resistance to oxidizing and reducing atmospheres at high temperatures. Zirconia does, however, lose a small amount of oxygen at very high temperatures in vacuum and inert or reducing atmospheres. Although this reaction results in a colour change from white to grey, other properties remain essentially unchanged.
Applications of Zirconia Substrates
- Sintering equipment
- Oven construction elements
- Medical technology
- Electronic sensors
- Catalyser
- Filtration of liquids
Benefits of Zirconia Substrates
- Hardness
- High mechanical strength
- Dimensional stability, even at high temperatures
- High resistance to wear and corrosion
- Electrically insulating
- Resistance to chemical products
- High-temperature withstand
- Dielectric and ferro-electric properties
- Very low adherence
- Exceptional flatness
- Low thermal conduction
Technical Data of Zirconia Substrates
A comparative table for the available Zirconia ceramic substrates can be downloaded in the data sheet.
Physical variables included in this documentation are provided by way of indication only and do not, under any circumstances, constitute a contractual undertaking. Please contact our technical service if you require any additional information.
FAQs that can help you in this category
Alumina (density of 3.95 g/cm³, Al₂O₃ 99.7%) has a moderate thermal conductivity of 25 to 30 W/(m·K) and a dielectric strength of 10 to 12 kV/mm. However, aluminium nitride (AlN) combines a density of approximately 3.2 g/cm³, a very high thermal conductivity (170 to 200 W/(m·K)) and a dielectric strength of 10 kV/mm while also remaining stable up to 1,000°C. Therefore AlN ensures better thermal transfers for critical electronic circuits, while alumina is mainly used for more cost-effective applications, or applications requiring only standard electrical insulation. If thermal dissipation is a determining factor, Final Advanced Materials recommends choosing AlN.
Ceramic substrates are available in standard thicknesses from 0.15 mm to 2.0 mm, with typical dimensions ranging from 50.8×50.8 mm to 168×168 mm depending on the material. Custom dimensions can be provided to meet specific requirements. Dimensional tolerance is generally +0.2/-0.05 mm. Final Advanced Materials can also provide substrates meeting industrial requirements, with machining, drilling or etching options for direct integration into electronic devices.
Yes, alumina Al₂O₃ or alumina nitride AlN ceramic substrates can be supplied with custom laser cutting, making it possible to produce complex shapes. Laser cutting ensures a neat cut, with tolerances of ±0.05 mm and low mechanical stress. This technology is particularly suitable for thin substrates (0.25–1.0 mm) and the production of small series requiring speed and precision.
Final Advanced Materials produces laser-cut substrates based on the plans provided by the client, while preserving dimensional stability and the material's electrical and thermal properties.