Share this page by mail Adhesive selector kit
Seven high temperature adhesives in convenient 4 oz. bottles. Ideal for simplifying products evaluation and selection.
Cotronics® Resbond® Ceramic Adhesives are based on high purity, ceramic binders and selected reinforcing fillers. These adhesives have excellent adhesion to ceramics, metals, glass and plastics and offer excellent high temperature stability, dielectric strength,mechanical properties and thermal shock resistance.
1650°C - Resbond® 901 Ceramic Fiber Adhesive and Coating is a high purity, Alumina Oxide based, Ceramic Composite that combines the refractory properties of Alumina with ceramic fiber reinforcement.
1287°C - Resbond® 907GF Fireproof Adhesive and Sealant is a moist, creamy putty for use from -300°F to 2350°F. It is easily applied from standard caulking cartridges and air dries in 4- 12 hours at room temperature.
1530°C - Resbond® 919 was formulated with Cotronics®’ proprietary ceramic binders to offer an adhesive with exceptionably high electrical resistance. These special binders maintain their high electrical resistance and dielectric strength even when exposed to temperatures up to 2800°F.
1650°C - Resbond® 989 is a one component high purity, 3000°F Alumina based, general purpose adhesive. It has a smooth creamy consistency and cures at room temperature to form strong bonds to ceramics, graphite, metals and glass.
1090°C - Resbond® 940 Standard has excellent adhesion to ceramics, glass, metals, etc. Offers excellent electrical, chemical and thermal shock resistance.
650°C - Resbond® 950 is easy to apply and cures at low temperature. Use with steel, cast iron, aluminium, copper, etc. Its easily machinable. Can be ground, sanded or polished.
980°C - Thermeez® 7030 High Expansion Adhesive Bonds and Protects to 1800°F. Asbestos free and safe to use. No objectionable odours or harmful fibers. Just mix to a smooth, creamy paste and apply.
Don't forget to prepare your surfaces ahead of bonding
The best way to ensure a long-lasting adhesive bond is to properly clean the parts before bonding them together. Our partner Bostik has developed a range of solutions under the Born2Bond™ brand specifically designed to cover all the different steps of the surface preparation process. These solutions are also recommended for adhesive bonding applications using Cotronics® products:
FAQs that can help you in this category
The choice depends mainly on the temperature and the mechanical stresses. Final Advanced Materials' high-temperature epoxy resins are generally limited to between 150 and 350°C, with satisfactory mechanical resistance (typical sheer-stress 10–30 MPa) and a degree of elasticity. However, the ceramic cements produced by Final Advanced Materials can be used up to 2,200°C, depending on the grade (alumina, zirconia, silicate, silica). They have excellent temperature resistance, but remain fragile (brittle behaviour, no elasticity). In the case of assemblies subject to differential expansion or vibration, epoxy is by far the preferred solution, if permitted by the maximum temperature of the application. However, in the case of extreme environments (kiln, vacuum, reducing atmosphere) which exceed 350°C, ceramic cement must be chosen.
The ceramic cements distributed by Final Advanced Materials have maximum working temperatures ranging between 650°C and 2,200°C. For example, alumina-based formulations often reach 1,650–1,760°C in an oxidising atmosphere. However, silicate systems are limited to around 1,000–1,200°C. The real maximum working temperature depends greatly on the environment (air, vacuum, inert gas), the time of exposure to this temperature and the thermal cycle (gradient, thermal shock). Specifically: the metal-loaded ceramic adhesives produced by Final Advanced Materials resist only up to the maximum temperature of the filler (650°C, for example, in the case of aluminium powder).
Ceramic/metal assemblies require often very different coefficients of thermal expansion (CTE) to be controlled. Final Advanced Materials recommends alumina-, silica- or zirconia-based ceramic cements for temperatures >350°C, which can bond to all types of ceramics and, generally, metals. For intermediate applications (≤350°C), an epoxy resin loaded with alumina powder enables thermal stresses to be absorbed and will be very compatible with different expansion coefficients. The thickness of the bond line must be between 100 and 300 µm to limit stress. Surface pre-treatment (sanding, degreasing, etc.) greatly improves adherence and is absolutely necessary if the CETs are very different.
The Cotronics adhesives distributed by Final Advanced Materials have variable cycles.
In the case of a cement, initial drying at ambient temperature takes between 2 to 24 h, depending on the viscosity and thickness. A thermal aftertreatment can be performed to allow them to attain their optimum properties after firing. Excessively rapid drying can lead to cracking or porosity in the cement.
Final Advanced Materials' epoxy adhesives which resist up to 260°C must be cured at ambient temperature. Epoxy adhesives which resist up to over 300°C require heat curing.