Mica Adhesive

Cotronics® Resbond® high temperature adhesive are based on high purity ceramic binders and selected reinforcing fillers.

These adhesives have excellent adhesion to ceramics, metals, glass and plastics. They offer excellent high temperature stability, dielectric strength, mechanical properties and thermal shock resistance.

Mica Adhesives

Resbond® 907

Resbond® 904 is a single component Ceramic Composite based on Mica platelets and proprietary ceramic binders. Resbond® 907 all-purpose adhesive offers high bond strength, solvent and electrical resistance. Safe to use. No objectionable or toxic odours. Use from -130°C to 1260°C. Resbond® 907 was developed to provide a Fire Proof Adhesive for applications in production, development, repair and maintenance. Just apply directly to clean steel, iron, lead, ceramics, most metals, etc. without any special surface treatment. Air dries in 24 - 48 hours at room temp. or in 1 hour at 120°C.

Resbond® 907GF

Resbond® 907GF Fireproof Adhesive and Sealant is a moist, creamy putty for use from -180°C to 1285°C. It is easily applied from standard caulking cartridges and air dries in 4- 12 hours at room temperature. Curing may be accelerated with mild heat. Resbond® 907GF has excellent adhesion to clean steel, stainless, iron, most metals, ceramics, ceramic cloths, tapes, gaskets, tadpoles’ gaskets, etc. Resistant to most chemicals, solvents, oxidizing and reducing atmospheres, aging, thermal cycling, and electricity. Packaged in convenient dispenser tubes and standard caulking cartridges. Resbond® 907GF is ideal for use in any high temperature Assembly, Production, Repair or Maintenance Application.

Technical data: Mica Adhesive

Mica Cement Adhesive

907

907GF

Peak Temperature

°C

1260

1650

Components

1

1

Consistence

Paste

Mastic

Charge

Mica

Mica

Compressive Strength

N/mm² (20°C)

24.1

10.3

Flexural Strength

N/mm² (20°C)

8.6

 -

Thermal Conductivity

W/mK

0.86

0.86

Thermal Expansion

x 10-6 K-1

8.1

 -

Dielectric Strength

kV/mm

11.7

5.6

Resistivity

Ω.cm

109

109

Mix Ratio

Powder - Binder

N.A.

N.A.

Cure Temp.

Hrs @

Room Temp.

24h

24 – 48h

Cure Temp.

°C

120°C

1h @ 120-175°C

Cotronics® - Mica Adhesives (179.59k)

Technical data sheet: Mica Cement Adhesive by Cotronics®.


Cotronics® - Ceramic Adhesives (825.22k)

Technical data sheet: full range of Cotronics® Ceramic Adhesives


Resbond® 907 mica adhesive

Resbond® 907 mica adhesive

Cotronics Resbond ® 907 adhesive is a mica based bonding ceramic cement . It is used to make high temperature bonding, up to 1260°C. This product is available in 0.23, 0.94 et 1.8 litres. For bigger packaging please contact us. We also offer other high temperature mica adhesives . 
Full description
Resbond® 907GF mica adhesive

Resbond® 907GF mica adhesive

Cotronics Resbond ® 907GF is a mica based bonding ceramic cement . It is used to make high temperature bonding, up to 1,250°C. This product is available in 230 mL, 940 mL, and 1,9 L. For bigger packaging please contact us. We offer a variety of  high temperature mica adhesive products. 
Full description
Cotronics Resbond 907GF ceramic adhesive high temperature

Resbond® 907GF mica adhesive (cartridge)

Cotronics Resbond ® 907GF adhesive is a mica-based ceramic bonding cement . It is used for high temperature bonding up to 1,250°C. The 907GF is packaged in ready-to-use cartridges of 320 mL and in 3x100 mL syringes. For larger sizes, please contact us. We offer a variety of  high temperature mica adhesive products. 
Full description
Resbond® 907T mica binder

Resbond® 907T mica binder

Cotronics Resbond ® 907T binder is a single component mica based fluidizer. It is used to fluidify Resbond ® 907 . It is recommended that no more than 5% binder is added to the ceramic cement . It is available in 870 mL. For larger packs, please contact us. We also offer other  high temperature mica adhesives . 
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FAQs that can help you in this category

Ceramic cement or high-temperature epoxy resin: which adhesive should I choose for a given application?

The choice depends mainly on the temperature and the mechanical stresses. Final Advanced Materials' high-temperature epoxy resins are generally limited to between 150 and 350°C, with satisfactory mechanical resistance (typical sheer-stress 10–30 MPa) and a degree of elasticity. However, the ceramic cements produced by Final Advanced Materials can be used up to 2,200°C, depending on the grade (alumina, zirconia, silicate, silica). They have excellent temperature resistance, but remain fragile (brittle behaviour, no elasticity). In the case of assemblies subject to differential expansion or vibration, epoxy is by far the preferred solution, if permitted by the maximum temperature of the application. However, in the case of extreme environments (kiln, vacuum, reducing atmosphere) which exceed 350°C, ceramic cement must be chosen.


What is the maximum working temperature of bonding ceramic cements?

The ceramic cements distributed by Final Advanced Materials have maximum working temperatures ranging between 650°C and 2,200°C. For example, alumina-based formulations often reach 1,650–1,760°C in an oxidising atmosphere. However, silicate systems are limited to around 1,000–1,200°C. The real maximum working temperature depends greatly on the environment (air, vacuum, inert gas), the time of exposure to this temperature and the thermal cycle (gradient, thermal shock). Specifically: the metal-loaded ceramic adhesives produced by Final Advanced Materials resist only up to the maximum temperature of the filler (650°C, for example, in the case of aluminium powder).


Which high-performance adhesive should I use to bond ceramic to metal?

Ceramic/metal assemblies require often very different coefficients of thermal expansion (CTE) to be controlled. Final Advanced Materials recommends alumina-, silica- or zirconia-based ceramic cements for temperatures >350°C, which can bond to all types of ceramics and, generally, metals. For intermediate applications (≤350°C), an epoxy resin loaded with alumina powder enables thermal stresses to be absorbed and will be very compatible with different expansion coefficients. The thickness of the bond line must be between 100 and 300 µm to limit stress. Surface pre-treatment (sanding, degreasing, etc.) greatly improves adherence and is absolutely necessary if the CETs are very different.


What are the curing and drying times of Cotronics technical adhesives?

The Cotronics adhesives distributed by Final Advanced Materials have variable cycles.

In the case of a cement, initial drying at ambient temperature takes between 2 to 24 h, depending on the viscosity and thickness. A thermal aftertreatment can be performed to allow them to attain their optimum properties after firing. Excessively rapid drying can lead to cracking or porosity in the cement.

Final Advanced Materials' epoxy adhesives which resist up to 260°C must be cured at ambient temperature. Epoxy adhesives which resist up to over 300°C require heat curing.