Cotronics® Resbond® Ceramic Adhesive
Cotronics® Resbond® high temperature adhesive are based on high purity ceramic binders and selected reinforcing fillers.
These adhesives have excellent adhesion to ceramics, metals, glass and plastics. They offer excellent high temperature stability, dielectric strength, mechanical properties and thermal shock resistance.
Resbond® 906 Magnesia Based Adhesive was formulated for bonding high expansion materials for use to 1650°C. Bonds to steel, stainless, aluminium, brass, copper, silver, nickel and other high expansion materials.
Resbond® 906 will cure at room temperature to form a highly thermally conductive bond. Strength and moisture resistance will be improved by a post cure at 315°C – 370°C. Resbond® has excellent resistance to oxidizing and reducing atmospheres, most chemicals and solvents. It is resistant to flame impingement and most liquid metals.
Resbond® 919 was formulated with Cotronics®’ proprietary ceramic binders to offer an adhesive with exceptionably high electrical resistance. These special binders maintain their high electrical resistance and dielectric strength even when exposed to temperatures up to 1530°C. Resbond® 919 has a dielectric strength of 270 volts/mil and a volume resistivity of 1011 ohm-cm at room temperature. Just mix the Resbond® 919 to a creamy paste, apply and dry at room temperature.
Resbond® is commonly used for electrical insulation when potting, sealing or coating, ignitors, thermocouples, heating coils, instrumentation, etc.