Magnesia Adhesive

Cotronics® Resbond® Ceramic Adhesive


Cotronics®
Resbond® high temperature adhesive are based on high purity ceramic binders and selected reinforcing fillers.

These adhesives have excellent adhesion to ceramics, metals, glass and plastics. They offer excellent high temperature stability, dielectric strength, mechanical properties and thermal shock resistance.

Magnesia Adhesives

Resbond® 906

Resbond® 906 Magnesia Based Adhesive was formulated for bonding high expansion materials for use to 1650°C. Bonds to steel, stainless, aluminium, brass, copper, silver, nickel and other high expansion materials.

Resbond® 906 will cure at room temperature to form a highly thermally conductive bond. Strength and moisture resistance will be improved by a post cure at 315°C – 370°C. Resbond® has excellent resistance to oxidizing and reducing atmospheres, most chemicals and solvents. It is resistant to flame impingement and most liquid metals.

Resbond® 919

Resbond® 919 was formulated with Cotronics®’ proprietary ceramic binders to offer an adhesive with exceptionably high electrical resistance. These special binders maintain their high electrical resistance and dielectric strength even when exposed to temperatures up to 1530°C. Resbond® 919 has a dielectric strength of 270 volts/mil and a volume resistivity of 1011 ohm-cm at room temperature. Just mix the Resbond® 919 to a creamy paste, apply and dry at room temperature.

Resbond® is commonly used for electrical insulation when potting, sealing or coating, ignitors, thermocouples, heating coils, instrumentation, etc.

Cotronics® - MgO Adhesives (254.19k)

Technical data sheet: MgO Cement Adhesive by Cotronics®.


Cotronics® - Ceramic Adhesives (825.22k)

Technical data sheet: full range of Cotronics® Ceramic Adhesives


Cotronics Resbond 906 adhesif ceramique magnesie haute temperature

Resbond® 906 magnesia adhesive

Cotronics Resbond ® 906 adhesive is a magnesia based bonding ceramic cement . It is used to make high temperature bonding, up to 1650°C. Resbond ® 906 can be fluidified with the 906T specific binder , never with water. Do not add more than 5% of binder to the cement. This product is available in 320 mL, 650 mL, and 2.8 L. For larger sizes, please contact us. We also offer other high temperature adhesives . 
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Resbond® 906T magnesia binder

Resbond® 906T magnesia binder

Cotronics Resbond ® 906T magnesia based binder is used to fluidify cement. It is used to fluidify the Resbond ® 906 ceramic cement. Do not add more than 5% of binder to the cement . This product is available in 460 mL, for bigger packaging please contact us.
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Cotronics Resbond 919 ceramic adhesive magnesia high temperature

Resbond® 919 magnesia adhesive

Cotronics Resbond ® 919 adhesive is a magnesia based bonding ceramic cement . It is used to make high temperature bonding, up to 1530°C. Resbond ® 919 can be fluidified with demineralized water . Do not add more than 5% of binder to the cement. This product is available in 940 mL, 3.7 L and 19 L. For larger sizes, please contact us. We also offer other high temperature adhesives . 
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FAQs that can help you in this category

Ceramic cement or high-temperature epoxy resin: which adhesive should I choose for a given application?

The choice depends mainly on the temperature and the mechanical stresses. Final Advanced Materials' high-temperature epoxy resins are generally limited to between 150 and 350°C, with satisfactory mechanical resistance (typical sheer-stress 10–30 MPa) and a degree of elasticity. However, the ceramic cements produced by Final Advanced Materials can be used up to 2,200°C, depending on the grade (alumina, zirconia, silicate, silica). They have excellent temperature resistance, but remain fragile (brittle behaviour, no elasticity). In the case of assemblies subject to differential expansion or vibration, epoxy is by far the preferred solution, if permitted by the maximum temperature of the application. However, in the case of extreme environments (kiln, vacuum, reducing atmosphere) which exceed 350°C, ceramic cement must be chosen.


What is the maximum working temperature of bonding ceramic cements?

The ceramic cements distributed by Final Advanced Materials have maximum working temperatures ranging between 650°C and 2,200°C. For example, alumina-based formulations often reach 1,650–1,760°C in an oxidising atmosphere. However, silicate systems are limited to around 1,000–1,200°C. The real maximum working temperature depends greatly on the environment (air, vacuum, inert gas), the time of exposure to this temperature and the thermal cycle (gradient, thermal shock). Specifically: the metal-loaded ceramic adhesives produced by Final Advanced Materials resist only up to the maximum temperature of the filler (650°C, for example, in the case of aluminium powder).


Which high-performance adhesive should I use to bond ceramic to metal?

Ceramic/metal assemblies require often very different coefficients of thermal expansion (CTE) to be controlled. Final Advanced Materials recommends alumina-, silica- or zirconia-based ceramic cements for temperatures >350°C, which can bond to all types of ceramics and, generally, metals. For intermediate applications (≤350°C), an epoxy resin loaded with alumina powder enables thermal stresses to be absorbed and will be very compatible with different expansion coefficients. The thickness of the bond line must be between 100 and 300 µm to limit stress. Surface pre-treatment (sanding, degreasing, etc.) greatly improves adherence and is absolutely necessary if the CETs are very different.


What are the curing and drying times of Cotronics technical adhesives?

The Cotronics adhesives distributed by Final Advanced Materials have variable cycles.

In the case of a cement, initial drying at ambient temperature takes between 2 to 24 h, depending on the viscosity and thickness. A thermal aftertreatment can be performed to allow them to attain their optimum properties after firing. Excessively rapid drying can lead to cracking or porosity in the cement.

Final Advanced Materials' epoxy adhesives which resist up to 260°C must be cured at ambient temperature. Epoxy adhesives which resist up to over 300°C require heat curing.