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Final Advanced Materials provides a range of epoxy resin products for bonding and moulding at 350°C max : adhesive resin, moulding resin, machinable boards...
Epoxy overview
Epoxy, also known as polyepoxide, is a thermosetting polymer formed from reaction of an epoxide "resin" with polyamine "hardener". Epoxy has a wide range of applications, including fiber-reinforced plastic materials and general purpose adhesives.
Epoxy is a copolymer; that is, it is formed from two different chemicals. These are referred to as the "resin" and the "hardener". The resin consists of monomers or short chain polymers with an epoxide group at either end.
Most common epoxy resins are produced from a reaction between epichlorohydrin and bisphenol-A, though the latter may be replaced by similar chemicals. The hardener consists of polyamine monomers, for example Triethylenetetramine (TETA). When these compounds are mixed together, the amine groups react with the epoxide groups to form a covalent bond. Each NH group can react with an epoxide group, so that the resulting polymer is heavily crosslinked, and is thus rigid and strong.
The process of polymerization is called "curing", and can be controlled through temperature, choice of resin and hardener compounds, and the ratio of said compounds; the process can take minutes to hours. Some formulations benefit from heating during the cure period, whereas others simply require time, and ambient temperatures.
Cotronics Epoxy Resin
Epoxy moulding resin
High performance casting, embedding and encapsulating compounds can be used for applications up to 315°C.
Epoxy electrically conductive Adhesive
Duralco® conductive adhesives and potting compounds provide the conductivity required for many high-temperature electronic and industrial applications.
Epoxy high-temperature Adhesive
High temperature epoxy-based adhesives, for temperatures up to 350 °C.
Epoxy thermally conductive Adhesive
Duralco® thermally conductive adhesives combine high-temperature resins with highly conductive fillers.
Machinable boards
Final Advanced Materials provides machinable boards, references E6000, E60 and E70, standard boards or finished parts according to your drawings.
Electrically Conductive Adhesives
High Temperature Epoxy
moulding resin
Technical Composite : Glass-Epoxy
Thermally conductive adhesive
FAQs that can help you in this category
The choice depends mainly on the temperature and the mechanical stresses. Final Advanced Materials' high-temperature epoxy resins are generally limited to between 150 and 350°C, with satisfactory mechanical resistance (typical sheer-stress 10–30 MPa) and a degree of elasticity. However, the ceramic cements produced by Final Advanced Materials can be used up to 2,200°C, depending on the grade (alumina, zirconia, silicate, silica). They have excellent temperature resistance, but remain fragile (brittle behaviour, no elasticity). In the case of assemblies subject to differential expansion or vibration, epoxy is by far the preferred solution, if permitted by the maximum temperature of the application. However, in the case of extreme environments (kiln, vacuum, reducing atmosphere) which exceed 350°C, ceramic cement must be chosen.
The ceramic cements distributed by Final Advanced Materials have maximum working temperatures ranging between 650°C and 2,200°C. For example, alumina-based formulations often reach 1,650–1,760°C in an oxidising atmosphere. However, silicate systems are limited to around 1,000–1,200°C. The real maximum working temperature depends greatly on the environment (air, vacuum, inert gas), the time of exposure to this temperature and the thermal cycle (gradient, thermal shock). Specifically: the metal-loaded ceramic adhesives produced by Final Advanced Materials resist only up to the maximum temperature of the filler (650°C, for example, in the case of aluminium powder).
Ceramic/metal assemblies require often very different coefficients of thermal expansion (CTE) to be controlled. Final Advanced Materials recommends alumina-, silica- or zirconia-based ceramic cements for temperatures >350°C, which can bond to all types of ceramics and, generally, metals. For intermediate applications (≤350°C), an epoxy resin loaded with alumina powder enables thermal stresses to be absorbed and will be very compatible with different expansion coefficients. The thickness of the bond line must be between 100 and 300 µm to limit stress. Surface pre-treatment (sanding, degreasing, etc.) greatly improves adherence and is absolutely necessary if the CETs are very different.
Calcium silicate boards have a low density (200–1,000 kg/m³), low thermal conductivity (~ 0.05–0.35 W/m·K) and high temperature resistance of up to 1,000°C. They are used as structural insulators.
Mica boards (phlogopite or muscovite) have great dielectric strength (>20 kV/mm) and temperature resistance up to 500–1,000°C, depending on the type. It must be permanently compressed between 2 other boards to preserve its mechanical integrity (the silicon binder degrades at high temperature). Use of mica composite requires particular attention: please contact Final Advanced Materials for more information.
Yes, the inorganic composites produced by Final Advanced Materials can be CNC machined. Machining of calcium silicate-based (CaSiO₃) refractories or derived materials of the insulating boards type involves specific aspects relating to their low density, high porosity and low mechanical cohesion. Although these composites are not hard, they pose a high risk of scaling and crumbling: loads must therefore be minimised, and stripping of material must be avoided. The resulting powder is very abrasive and it is therefore essential that a dust extraction system is installed on your machinery. We can machine these materials in our production shop.