Epoxy

Epoxy

Final Advanced Materials provides a range of epoxy resin products for high temperature applications : adhesive resin, moulding resin, machinable boards...

Epoxy presentation

Epoxy, also known as polyepoxide, is a thermosetting polymer formed from reaction of an epoxide "resin" with polyamine "hardener". Epoxy has a wide range of applications, including fiber-reinforced plastic materials and general purpose adhesives.

Epoxy is a copolymer; that is, it is formed from two different chemicals. These are referred to as the "resin" and the "hardener". The resin consists of monomers or short chain polymers with an epoxide group at either end.

Most common epoxy resins are produced from a reaction between epichlorohydrin and bisphenol-A, though the latter may be replaced by similar chemicals. The hardener consists of polyamine monomers, for example Triethylenetetramine (TETA). When these compounds are mixed together, the amine groups react with the epoxide groups to form a covalent bond. Each NH group can react with an epoxide group, so that the resulting polymer is heavily crosslinked, and is thus rigid and strong.

The process of polymerization is called "curing", and can be controlled through temperature, choice of resin and hardener compounds, and the ratio of said compounds; the process can take minutes to hours. Some formulations benefit from heating during the cure period, whereas others simply require time, and ambient temperatures.

Cotronics® Epoxy resin

For bonding and moulding up to 350°C max.

Moulding resin

High performance casting, embedding and encapsulating compounds can be used for applications up to 315°C.

Electrically conductive adhesive

Duralco®conductive adhesives and potting compounds provide the conductivity required for many high temperature electronic and industrial applications.

High temperature adhesive

High temperature epoxy-based adhesives, for temperatures up to 350°C.

Thermally conductive adhesive

Duralco® thermally conductive adhesives combine high temperature resins with highly conductive fillers.

Machinable boards

Final Advanced Materials provides machinable boards, references E6000, E60 and E70 :

  • Standard boards
  • Finished parts according to your drawings

Electrically Conductive adhesive

Cotronics ® Duralco ® conductive adhesives and potting compounds provide the conductivity required for many high temperature electronic and industrial applications. High temperature...
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Epoxy moulding resin

Cotronics ® high performance casting, embedding and encapsulating compounds can be used for applications up to 315°C. Cotronics ® moulding resin 861 Low viscosity impregnant : 260°C...
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High temperature adhesive

Cotronics ® high temperature epoxy-based adhesives, for temperatures up to 350°C. Cotronics ® epoxy resin Duralco ® 4400, 4420 : Specific applications Duralco ® 4460, 4461,...
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Machinable board

Final Advanced Materials provides standard boards or finished parts according to your drawings Machinable board presentation Machinable technical composite can be used at a maximum...
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Thermally conductive adhesive

Cotronics ® Duralco ® thermally conductive adhesives combine high temperature resins with highly conductive fillers. High temperature thermally conductive epoxy resin Duralco ® 128 :...
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